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Magnetron Sputtering

Magnetron Sputtering System JCP350

Feature/Function:

* Less occupied area, competitive price, stable performance and low maintenance costs;
* Can be used for the preparation of single and multi-layer metal film, dielectric film, semiconductor film, magnetic film, sensor film, heat-resistant alloy film, hard film, corrosion-resistant film, etc.;
* Coating samples: silver, aluminum, copper, nickel, chromium, nickel-chromium alloy, titanium oxide, ITO, silica, etc .;
* Single target sputtering, multi-target sputtering in turns, multi-target sputtering simultaneously and so on functions.


Application: Colleges & universities, research institutes and enterprises develop new thin film materials and samll batch production.


Technical Parameters

Equipment NameMagnetron Sputtering System
ModelJCP350
Chamber Structure

Vertical top cover structure, rear pumping system, automatic

 pneumatic open type

Chamber SizeΦ350×H350mm
Baking TemperatureRoom temperature~500(932)
Sputtering PathUpward
Rotating Substrate HolderΦ120mm
Film Thickness NonuniformityWithin the scope of Φ75mm≤±5.0%

Sputtering Target/Evaporation

 Electrode

2 Pcs of Φ2 Inches magnetron targets, reserved 1 pc of target

 position

Process Gas2-3 Routes gas flow control
Control MethodPLC Control/IPC automatic control(optional) 
Occupied Area(Mainframe) L1600×W800×H1700mm
Power≥10kW