Sales Manager: Mr. Peng
Tel: +86 136 0112 5769
E-mail:sales@technol.cn
Feature/Function:
* Less occupied area, competitive price, stable performance and low maintenance costs;
* Can
be used for the preparation of single and multi-layer metal
film, dielectric film, semiconductor film, magnetic film, sensor film,
heat-resistant alloy film, hard film, corrosion-resistant film, etc.;
* Coating samples: silver, aluminum, copper, nickel, chromium, nickel-chromium alloy, titanium oxide, ITO, silica, etc .;
* Single target sputtering, multi-target sputtering in turns, multi-target sputtering simultaneously and so on functions.
Application: Colleges & universities, research institutes and enterprises develop new thin film materials and samll batch production.
Technical Parameters
Equipment Name | Magnetron Sputtering System |
Model | JCP350 |
Chamber Structure | Vertical top cover structure, rear pumping system, automatic pneumatic open type |
Chamber Size | Φ350×H350mm |
Baking Temperature | Room temperature~500℃(932℉) |
Sputtering Path | Upward |
Rotating Substrate Holder | Φ120mm |
Film Thickness Nonuniformity | Within the scope of Φ75mm≤±5.0% |
Sputtering Target/Evaporation Electrode | 2 Pcs of Φ2 Inches magnetron targets, reserved 1 pc of target position |
Process Gas | 2-3 Routes gas flow control |
Control Method | PLC Control/IPC automatic control(optional) |
Occupied Area | (Mainframe) L1600×W800×H1700mm |
Power | ≥10kW |