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HOME >PRODUCTS > Combination System > Sputtering & Ion Plating

Sputtering & Ion Plating TSU650


Features:

Equipped with circular magnetron sputtering target, rectangular magnetron sputtering target, multi-arc target, magnetic filter arc source, etc. Combined with magnetron, ion plating and other various functions, suitable for the universities and scientific research units with multiple coating requirements.

 

Functions:

1. The equipment can be used to prepare single and multi-layer metal film, dielectric film, semiconductor film, sensor film, heat-resistant alloy film, hard film, corrosion-resistant film, etc.;
2. Coating samples: silver, aluminum, copper, nickel, chromium, nickel-chromium alloy, titanium nitride, titanium carbide, titanium nitride, chromium nitride, titanium oxide, alumina, ITO, etc.;
3. Applications: tool, mold, electronic accessories, metal shell, ceramic substrate, etc..

 

Technical Parameters:

Equipment Name Sputtering & Ion Plating System
Model TSU650
Chamber Structure Vertical cylindrical front door structure, double-layer water cooling
Chamber Size Φ650×H650mm
Rotating Workpiece Rack Φ350×H400mm, 4~6 workstations revolution / rotation workpiece rest
Workpiece Rack Baking Temperature Room temperature~500±5℃(932±41℉), adjustable and controllable (PID control temperature)
Workpiece Rack Movement 0-5RPM adjustable
Auxiliary ion source Bias voltage, auxiliary linear ion source (optional)
Cathode Rectangular magnetron target, plane arc source, magnetic filter arc source, circular flat target (optional)
Control Method PLC Control / IPC automatic control (optional)
Occupied Area (Mainframe) L2780×W1200×H2020mm
Power ≥70Kw

 

Application: It is widely used in the research and small batch preparation of new film materials for colleges & universities, research institutes and enterprises.