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Supttering System JCP200


Features:

1. Dual-use sputtering and evaporation function, less occupied area, competitive price, stable performance and low maintenance costs;
2. Can be used for the preparation of single and multi-layer metal film, dielectric film, semiconductor film, magnetic film, sensor film, heat-resistant alloy film, hard film, corrosion-resistant film, etc.;
3. Coating samples: silver, aluminum, copper, nickel, chromium, nickel-chromium alloy, titanium oxide, ITO, silica, etc.;
4. Single target sputtering, multi-target sputtering in turns, multi-target sputtering simultaneously and so on functions.

 

Technical Parameters:

Equipment Name Magnetron Sputtering System
Model JCP200
Chamber Structure Vertical top cover structure, bottom pumping system, manual pneumatic spring pull open type
Chamber Size Φ210×H310mm
Baking Temperature Room temperature to 350℃ (662℉)
Sputtering Path Upward
Rotating Substrate Holder Φ100mm
Film Thickness Nonuniformity Within the scope of Φ50mm≤±5.0%
Sputtering Target / Evaporation Electrode 1 Pc of Φ2 Inches magnetron target, reserved 1 group of evaporation electrode interface
Process Gas 1-2 Routes gas flow control
Control Method PLC Control / IPC automatic control (optional)
Occupied Area (Mainframe) L600×W800×H1700mm
Power ≥7Kw

 

Application: It is widely used in the research and small batch preparation of new film materials for colleges & universities, research institutes and enterprises.